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High Efficiency Automatic Metal Plating Equipment For Electronic Product Machinery And PCB Electroplating

Dongguan Precision Test Equipment Co., Ltd.
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High Efficiency Automatic Metal Plating Equipment For Electronic Product Machinery And PCB Electroplating

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Brand Name : PRECISION

Model Number : AE-270

Certification : ISO

Place of Origin : CHINA

MOQ : 1

Price : $6000

Payment Terms : T/T

Supply Ability : 100/month

Delivery Time : 15 working days

Packaging Details : Standard export packaging

Customized support : OEM ODM

Origin : China

Material : Stainless Steel

Refrigerant : Environmental friendly R23/R404

Machine type : Plating Machine

Pre-Treatment System : Washing Equipment, Degreasing Equipment, etc.

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High - Efficiency Automatic Metal Plating Equipment for Electronic Product Machinery and PCB Electroplating

1. Introduction

In the dynamic and highly competitive realm of electronic product manufacturing, the quality and efficiency of metal plating processes play a pivotal role. Metal plating not only enhances the aesthetic appeal of electronic components but also significantly improves their functionality, durability, and electrical performance. High - efficiency automatic metal plating equipment, specifically tailored for electronic product machinery and printed circuit board (PCB) electroplating, has emerged as a game - changing solution for modern manufacturers. This advanced machinery is designed to meet the stringent demands of the electronics industry, ensuring precise, consistent, and rapid plating operations.

2. Key Features

2.1 Automated Process Control

  • Precision Parameter Management: At the heart of this equipment lies a sophisticated automated control system. Using advanced programmable logic controllers (PLCs) and intuitive software interfaces, every aspect of the electroplating process can be precisely regulated. Parameters such as plating time, current density, temperature, and chemical concentration of the plating bath are monitored and adjusted in real - time. For example, when plating PCBs, the system can accurately control the current density to ensure uniform copper deposition across the board's surface. This precision is crucial for maintaining the integrity of electrical traces and ensuring optimal performance of the final product.
  • Seamless Workflow Integration: The automated control system enables seamless integration of different stages of the plating process. From the pre - treatment of the metal substrate, which involves cleaning, degreasing, and surface activation, to the actual electroplating and post - treatment steps like rinsing and drying, the equipment can manage the entire workflow without manual intervention. This not only reduces the risk of human error but also accelerates the overall production cycle.

2.2 High - Efficiency Plating Chambers

  • Optimized Design for Uniform Coating: The plating chambers are engineered with a focus on achieving uniform metal deposition. They feature innovative agitation and circulation systems that ensure the plating solution is evenly distributed around the workpiece. In the case of PCB electroplating, specialized fixtures are used to hold the boards in place, allowing the solution to reach all areas, including the smallest vias and traces. This results in a consistent coating thickness across the entire PCB, which is essential for reliable electrical connections.
  • High - Volume Processing Capacity: To meet the high - volume production requirements of the electronics industry, the plating chambers are designed to handle multiple workpieces simultaneously. For example, in the production of small electronic components like connectors or capacitors, the chambers can be configured to accommodate a large number of parts in a single plating cycle. This significantly increases the throughput of the equipment, enabling manufacturers to meet tight production schedules.

2.3 Advanced Plating Technology

  • Selective Plating Capabilities: This metal plating equipment offers selective plating options, which are particularly useful for PCB manufacturing. Selective plating allows for the deposition of metal only in specific areas of the PCB, reducing the amount of plating material used and minimizing the risk of short - circuits. Using advanced masking techniques and precise control of the electrical current, the equipment can accurately target the areas that require plating, such as the pads for component soldering or the traces for signal transmission.
  • Multi - Layer Plating for Enhanced Performance: In many electronic applications, multi - layer plating is essential to achieve the desired combination of properties. The equipment is capable of depositing multiple layers of different metals, such as a base layer of copper for electrical conductivity, followed by a layer of nickel for corrosion resistance and a top layer of gold for enhanced solderability and durability. This multi - layer plating process can be precisely controlled to ensure the integrity and performance of the plated components.

2.4 Energy - Saving and Environment - Friendly Design

  • Energy - Efficient Operation: The equipment is designed with energy - saving features to reduce operational costs and environmental impact. Advanced power management systems are employed to optimize the use of electrical energy during the plating process. For example, the system can adjust the power supply based on the real - time requirements of the plating operation, reducing energy consumption without sacrificing plating quality.
  • Waste Management and Recycling: In line with environmental sustainability goals, the metal plating equipment incorporates waste management and recycling systems. The plating baths are equipped with filtration and purification units to remove impurities and extend the lifespan of the plating solution. Additionally, the equipment can recover and recycle valuable metals from the waste stream, reducing the need for virgin metal extraction and minimizing environmental pollution.

3. Specifications

Machine type Plating Machine
Warranty 1 Year
Weight(kg) 130000
Test Report Provided
Core components PLC, Engine, Bearing, Gearbox, motor
dimension(l*w*h) Customized
key selling points Easy to Operate
Material of Framework Square Steel Pipe
Material of Tank PP, PVC, Stainless Steel
Control System PLC Control System
Model Type Full-Automatic, Semi-Automatic, Manual
Pre-Treatment System Washing Equipment, Degreasing Equipment, etc.
After-Treatment System Washing Equipment, Drying etc
Auxiliary Equipment Rectifier, Dryer, Filter and Waste Gas Treatment Equipment etc
Application Metal Surface Plating
Output Customized

4. Benefits for Electronic Product Manufacturers

Product Tags:

High Efficiency electroplating machine

      

Automatic electroplating machine

      

High Efficiency electroplating equipment

       China High Efficiency Automatic Metal Plating Equipment For Electronic Product Machinery And PCB Electroplating wholesale

High Efficiency Automatic Metal Plating Equipment For Electronic Product Machinery And PCB Electroplating Images

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